BOISE, Idaho, Feb. 26, 2024 (GLOBE NEWSWIRE) — Micron Expertise, Inc. (Nasdaq: MU), a world chief in reminiscence and storage options, as we speak introduced it has begun quantity manufacturing of its HBM3E (Excessive Bandwidth Reminiscence 3E) answer. Micron’s 24GB 8H HBM3E might be a part of NVIDIA H200 Tensor Core GPUs, which can start transport within the second calendar quarter of 2024. This milestone positions Micron on the forefront of the {industry}, empowering synthetic intelligence (AI) options with HBM3E’s industry-leading efficiency and power effectivity.
HBM3E: Fueling the AI Revolution
Because the demand for AI continues to surge, the necessity for reminiscence options to maintain tempo with expanded workloads is crucial. Micron’s HBM3E answer addresses this problem head-on with:
- Superior Efficiency: With pin velocity higher than 9.2 gigabits per second (Gb/s), Micron’s HBM3E delivers greater than 1.2 terabytes per second (TB/s) of reminiscence bandwidth, enabling lightning-fast information entry for AI accelerators, supercomputers, and information facilities.
- Distinctive Effectivity: Micron’s HBM3E leads the {industry} with ~30% decrease energy consumption in comparison with aggressive choices. To help rising demand and utilization of AI, HBM3E provides most throughput with the bottom ranges of energy consumption to enhance essential information heart operational expense metrics.
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Seamless Scalability: With 24 GB of capability as we speak, Micron’s HBM3E permits information facilities to seamlessly scale their AI purposes. Whether or not for coaching large neural networks or accelerating inferencing duties, Micron’s answer gives the required reminiscence bandwidth.
“Micron is delivering a trifecta with this HBM3E milestone: time-to-market management, best-in-class {industry} efficiency, and a differentiated energy effectivity profile,” stated Sumit Sadana, govt vp and chief enterprise officer at Micron Expertise. “AI workloads are closely reliant on reminiscence bandwidth and capability, and Micron could be very well-positioned to help the numerous AI development forward by way of our industry-leading HBM3E and HBM4 roadmap, in addition to our full portfolio of DRAM and NAND options for AI purposes.”
Micron developed this industry-leading HBM3E design utilizing its 1-beta expertise, superior through-silicon through (TSV), and different improvements that allow a differentiated packaging answer. Micron, a confirmed chief in reminiscence for two.5D/3D-stacking and superior packaging applied sciences, is proud to be a accomplice in TSMC’s 3DFabric Alliance and to assist form the way forward for semiconductor and system improvements.
Micron can be extending its management with the sampling of 36GB 12-Excessive HBM3E, which is ready to ship higher than 1.2 TB/s efficiency and superior power effectivity in comparison with aggressive options, in March 2024. Micron is a sponsor at NVIDIA GTC, a world AI convention beginning March 18, the place the corporate will share extra about its industry-leading AI reminiscence portfolio and roadmaps.
About Micron Expertise, Inc.
We’re an {industry} chief in progressive reminiscence and storage options remodeling how the world makes use of info to complement life for all. With a relentless give attention to our prospects, expertise management, and manufacturing and operational excellence, Micron delivers a wealthy portfolio of high-performance DRAM, NAND and NOR reminiscence and storage merchandise by way of our Micron® and Essential® manufacturers. Day by day, the improvements that our folks create gasoline the info economic system, enabling advances in synthetic intelligence and 5G purposes that unleash alternatives — from the info heart to the clever edge and throughout the consumer and cellular consumer expertise. To be taught extra about Micron Expertise, Inc. (Nasdaq: MU), go to micron.com.
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